OPPSTAR

0.670

+0.035 (+5.5%)

OTHERS EXECUTION OF A DESIGN SERVICE AGREEMENT FOR THE DESIGN AND DEVELOPMENT OF A RECONFIGURABLE ARTIFICIAL INTELLIGENCE ("AI") CHIP SOLUTION BETWEEN A TECHNOLOGY COMPANY BASED IN YOKOHAMA, JAPAN ("CLIENT") AND OPPSTAR MICROELECTRONICS SDN BHD ("OPPSTAR MICROELECTRONICS")

OPPSTAR BERHAD

Type Announcement
Subject OTHERS
Description 
EXECUTION OF A DESIGN SERVICE AGREEMENT FOR THE DESIGN AND DEVELOPMENT OF A RECONFIGURABLE ARTIFICIAL INTELLIGENCE ("AI") CHIP SOLUTION BETWEEN A TECHNOLOGY COMPANY BASED IN YOKOHAMA, JAPAN ("CLIENT") AND OPPSTAR MICROELECTRONICS SDN BHD ("OPPSTAR MICROELECTRONICS")

1. INTRODUCTION

 

The Board of Directors of Oppstar wishes to announce that its wholly-owned subsidiary, Oppstar Microelectronics, has, on 25 May 2026, entered into a Design Service Agreement ("Agreement") with the Client. 

 

Please refer to the attached document for further details.

 

This announcement is dated 25 May 2026.


Please refer attachment below.

Attachments

Oppstar-Design Service Agreement.pdf
313.4 kB


Announcement Info

Company Name OPPSTAR BERHAD
Stock Name OPPSTAR
Date Announced 25 May 2026
Category General Announcement for PLC
Reference Number GA1-25052026-00037


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