NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING LEFORM BERHAD ("LEFORM" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF LEFORM PURSUANT TO SECTIONS 75 AND 76 OF THE COMPANIES ACT 2016 ("PRIVATE PLACEMENT")
| LEFORM BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | LEFORM BERHAD ("LEFORM" OR THE "COMPANY")
PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF LEFORM PURSUANT TO SECTIONS 75 AND 76 OF THE COMPANIES ACT 2016 ("PRIVATE PLACEMENT") |
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The terms used herein, unless the context otherwise stated, bear the same meaning as those defined in the earlier announcements in relation to the Private Placement. We refer to the earlier announcements dated 28 February 2025, 19 March 2025, 25 March 2025, 22 September 2025 and 6 March 2026 in relation to the Private Placement. On behalf of the Board, UOBKH wishes to announce that the Board had on 6 March 2026 resolved to fix the issue price for the Private Placement at RM0.1688 per Placement Share. The issue price of RM0.1688 per Placement Share represents a discount of approximately 3.65% to the 5-day volume weighted average market price ("VWAP") of Leform Shares up to and including 5 March 2026, being the last traded day of Leform Shares immediately preceding the price-fixing date of RM0.1752 per Leform Share.
This announcement is dated 6 March 2026. |
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Announcement Info
| Company Name | LEFORM BERHAD |
| Stock Name | LEFORM |
| Date Announced | 06 Mar 2026 |
| Category | General Announcement for PLC |
| Reference Number | GA1-06032026-00061 |