HTPADU

1.450

-0.07 (-4.6%)

NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PRIVATE PLACEMENT

HEITECH PADU BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")

PRIVATE PLACEMENT

Reference is made to the Company’s announcements dated 9 May 2025, 13 May 2025, 9 June 2025, 25 June 2025, 10 July 2025, 11 July 2025, 26 August 2025, 3 September 2025, 8 September 2025, 19 September 2025, 22 September 2025, 26 September 2025, 21 November 2025 and 28 November 2025 as well as the circular to shareholders dated 10 June 2025 in relation to, among others, the Private Placement (“Circular”). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the Circular.

 

On behalf of the Board, RHB Investment Bank wishes to announce that the approval from Bursa Securities dated 28 November 2025 to complete the implementation of the Private Placement has lapsed on 6 March 2026.

 

Under the Private Placement, the Company has issued a total of 23,800,000 Placement Shares at an issue price of RM1.55 each, which raised total gross proceeds of approximately RM36.9 million from the Private Placement.

 

As the Company has decided not to place out the remaining Placement Shares, the Private Placement is deemed completed on 6 March 2026.

 

This announcement is dated 6 March 2026.






Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 06 Mar 2026
Category General Announcement for PLC
Reference Number GA1-02032026-00099